Technical Capabilities

Manufacturing Excellence
in Every Specification

From 2-layer prototypes to 32-layer HDI production — explore our full range of PCB and PCBA manufacturing capabilities.

PCB Manufacturing Specifications

ParameterCapabilityStandard
Layer Count2 – 32 layersAdvanced
HDIAny-layer, 1+N+1, 2+N+2Advanced
Min Trace / Space3 / 3 mil (0.075 / 0.075 mm)Fine-line
Min Mechanical Drill0.15 mmStandard
Min Laser Drill0.075 mmMicrovia
Impedance Control±5% (TDR tested)Precision
Board Thickness0.2 mm – 6.0 mmFull Range
Max Board Size600 mm × 800 mmLarge Format
Aspect Ratio12:1Standard
Copper Weight0.5 oz – 12 ozHeavy Copper

Surface Finishes

Finish TypeIPC StandardBest For
ENIG (Electroless Nickel Immersion Gold)IPC-4552Fine-pitch, wire bonding, long shelf life
OSP (Organic Solderability Preservative)IPC-4554Cost-effective, RoHS compliant
HASL Lead-FreeIPC-4553General purpose, excellent solderability
Immersion SilverIPC-4556High-frequency RF, fine-line
Immersion TinIPC-4555Press-fit connectors, flat surface
Hard Gold (Electrolytic)IPC-4552Edge connectors, high-wear contacts

Base Materials

MaterialTg (°C)Td (°C)Applications
Standard FR-4135 – 140310Consumer electronics, general purpose
High-Tg FR-4170 – 180350Automotive, industrial, lead-free soldering
Rogers 4350B / 4003C280390RF, microwave, high-frequency
Aluminum (Metal Core)130 – 150—LED lighting, power electronics
Ceramic (Al₂O₃ / AlN)——High-power, high-thermal applications
Polyimide250420Flexible circuits, high-temp applications

Special Processes

Blind & Buried Vias

Multiple lamination cycles for complex HDI stackups with blind and buried via structures.

Back Drilling

Stub removal for high-speed signals. Controlled depth drilling with ±0.05mm accuracy.

Via-in-Pad

Via filling with conductive or non-conductive epoxy, plated over for BGA pad placement.

Rigid-Flex

Combined rigid and flexible sections in one board. Polyimide flex with FR-4 rigid areas.

Edge Plating

Plated board edges for shielding, grounding, and mechanical protection.

Countersink / Counterbore

Precision mechanical machining for mounting holes with tight depth tolerance.

PCBA / SMT Assembly Specifications

ParameterCapability
SMT Lines8 fully automated high-speed lines
Placement Capacity8,000,000 placements per day
Component Range0201 (0.6×0.3mm) to 55×55mm BGA/QFP
Minimum Pitch0.3mm (QFP/QFN), 0.25mm (BGA)
Assembly TypesSMT, THT, Mixed, Flex, Rigid-Flex
Solder Paste Inspection3D SPI on all lines
AOI Inspection3D AOI — 100% of boards
BGA InspectionX-Ray (2D + CT tomography available)
In-Circuit TestICT — flying probe and bed-of-nails
Functional TestFCT — custom test fixtures built in-house
Conformal CoatingSelective spray and manual brush
Potting / EncapsulationEpoxy and silicone potting available
PCB Layer Structure

Technology

Multi-Layer PCB Structure

Every layer precisely aligned and bonded. Our advanced lamination process ensures perfect registration and impedance control across all 2 to 32 layers. Each via type — through-hole, blind, buried, or microvia — is optimized for your specific design requirements.

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Process

SMT Assembly Process

From solder paste printing to final inspection — each step monitored and controlled. 3D SPI checks every paste deposit. High-speed placement with 8-head gantry machines. 10-zone reflow ovens with nitrogen atmosphere for perfect soldering.

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SMT Assembly Process
Box Build Assembly

Value-Added

Box Build & Final Assembly

Beyond PCBs and PCBA — we assemble your complete product. Enclosure integration, wiring harnesses, functional testing, labeling, and customized packaging. Your product ships ready for your customer.

3 assembly lines — dedicated box build stations
Conformal coating — selective spray for harsh environments
Custom FCT fixtures — designed and built in-house
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Have a Technical Requirement?

Send us your specs — Gerber files, BOM, assembly drawings. Our engineers will review and respond within 24 hours.

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